Home Uncategorized Circuit Designers And Builders: You Need To Understand IC Packages

Circuit Designers And Builders: You Need To Understand IC Packages

Integrated circuits (ICs) are etched into tiny silicon chips. ICs may be part of larger electronic circuits or they may be a complete system by themselves. These components are packaged in ceramic, plastic, leadless or glass.

 

The sizes of the packages have assigned names and specifications. Often, we finish design with a particular IC without considering the type of packages available for such IC and the problem of soldering or placing the component shows up.

 

This is a common problem among hobbyists and students. In order to avoid this in your next project, try and check for the package type before you move on.

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The following are the assigned names of some packages with their photos;

CBGA – Ceramic Ball Grid Array

CCGA – Ceramic Column Grid Array

CerDIP – Ceramic Dual-in-Line Package

CerPack – Ceramic Package

CLCC – Ceramic Leadless Chip Carrier

CLCC – Ceramic Leadless Chip Carrier

PQFP – Plastic Quad Flat Pack

PSOP – Power Small Outline Package

QFN – Quad Flat No Leads Package

QSOP – Quarter Size Outline Package

SBDIP – Sidebraze Dual-in-Line Package

SC-70 – Small Outline Transistor

SIP – Single-In-Line Package

CQFP – Ceramic Quad Flat Pack

SOIC – Small Outline IC Package

D2PAK or DDPAK – Dou-ble Decawatt Package

D3PAK – Decawatt Package 3

SOJ – Small Outline J-Lead Package

SOT-23 – Small Outline Transistor

DFN – Dual Flat No Leads Package

SOT-23 – Small Outline Transistor

DPAK – Decawatt Package

SSOP – Shrink Small Outline Package

TDFN – Thin Dual Flat No Leads Package

TFBGA – Thin Fine-Pitch Ball Grid Array

TQFN – Thin Quad Flat No Leads Package

TQFP – Thin Quad Flat Pack

TSOP – Thin Small Outline Package

TSSOP – Thin Shrink Small Outline Package

FBGA – Fine-Pitch Ball Grid Array

UTDFN – Ultra Thin Dual Flat No Leads Package

UTQFN – Ultra Thin Quad Flat No Leads Package

VFBGA – Very Thin Fine-Pitch Ball Grid Array

VSOP – Very Small Outline Package

XDFN – Extreme Thin Dual Flat No Leads Package

XQFN – Extreme Thin Quad Flat No Leads Package

JLCC – J-Leaded Ceramic Chip Carrier

LFBGA – Low Profile Fine-Pitch Ball Grid Array

LGA – Land Grid Array

LQFP – Low-Profile Quad Flat Package

MLP – Micro Leadframe Package

MQFP – Metric Quad Flat Package

MSOP – Micro Small Outline Package

PBGA – Plastic Ball Grid Array

PDIP – Plastic Dual-in-Line Package

PLCC – Plastic Leaded Chip Carrier

PPGA – Plastic Pin Grid Array

PQFN – Power Quad Flat No Leads Package

 

 

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