Integrated circuits (ICs) are etched into tiny silicon chips. ICs may be part of larger electronic circuits or they may be a complete system by themselves. These components are packaged in ceramic, plastic, leadless or glass.
The sizes of the packages have assigned names and specifications. Often, we finish design with a particular IC without considering the type of packages available for such IC and the problem of soldering or placing the component shows up.
This is a common problem among hobbyists and students. In order to avoid this in your next project, try and check for the package type before you move on.
Tekedia Mini-MBA edition 16 (Feb 10 – May 3, 2025) opens registrations; register today for early bird discounts.
Tekedia AI in Business Masterclass opens registrations here.
Join Tekedia Capital Syndicate and invest in Africa’s finest startups here.
The following are the assigned names of some packages with their photos;
CBGA – Ceramic Ball Grid Array
CCGA – Ceramic Column Grid Array
CerDIP – Ceramic Dual-in-Line Package
CerPack – Ceramic Package
CLCC – Ceramic Leadless Chip Carrier
CLCC – Ceramic Leadless Chip Carrier
PQFP – Plastic Quad Flat Pack
PSOP – Power Small Outline Package
QFN – Quad Flat No Leads Package
QSOP – Quarter Size Outline Package
SBDIP – Sidebraze Dual-in-Line Package
SC-70 – Small Outline Transistor
SIP – Single-In-Line Package
CQFP – Ceramic Quad Flat Pack
SOIC – Small Outline IC Package
D2PAK or DDPAK – Dou-ble Decawatt Package
D3PAK – Decawatt Package 3
SOJ – Small Outline J-Lead Package
SOT-23 – Small Outline Transistor
DFN – Dual Flat No Leads Package
SOT-23 – Small Outline Transistor
DPAK – Decawatt Package
SSOP – Shrink Small Outline Package
TDFN – Thin Dual Flat No Leads Package
TFBGA – Thin Fine-Pitch Ball Grid Array
TQFN – Thin Quad Flat No Leads Package
TQFP – Thin Quad Flat Pack
TSOP – Thin Small Outline Package
TSSOP – Thin Shrink Small Outline Package
FBGA – Fine-Pitch Ball Grid Array
UTDFN – Ultra Thin Dual Flat No Leads Package
UTQFN – Ultra Thin Quad Flat No Leads Package
VFBGA – Very Thin Fine-Pitch Ball Grid Array
VSOP – Very Small Outline Package
XDFN – Extreme Thin Dual Flat No Leads Package
XQFN – Extreme Thin Quad Flat No Leads Package
JLCC – J-Leaded Ceramic Chip Carrier
LFBGA – Low Profile Fine-Pitch Ball Grid Array
LGA – Land Grid Array
LQFP – Low-Profile Quad Flat Package
MLP – Micro Leadframe Package
MQFP – Metric Quad Flat Package
MSOP – Micro Small Outline Package
PBGA – Plastic Ball Grid Array
PDIP – Plastic Dual-in-Line Package
PLCC – Plastic Leaded Chip Carrier
PPGA – Plastic Pin Grid Array
PQFN – Power Quad Flat No Leads Package